Materials
- Body: Advanced Ceramic
- Terminations: Ag/Ni/Sn (100 % Lead-free)
- Element Cover Coating: Lead-free Glass
Moisture Sensitivity Level
- IPC/JEDEC J-STD-020, Level 1
Solderability
- IPC/EIC/JEDEC J-STD-002, Condition B
- JESD22-B102E Method 1
Humidity Test
- MIL-STD-202, Method 103, Conditions D
Resistance to Solder Heat
- MIL-STD-202, Method 210, Condition B
Thermal Shock
- MIL-STD-202, Method 107, Condition B
Mechanical Shock
- MIL-STD-202, Method 213, Condition A
- MIL-STD-202 Method 213, Test Condition C
Vibration, High Frequency
- MIL-STD-202, Method 204, Condition D
Dissolution of Metallization
- IPC/EIC/JEDEC J-STD-002, Condition D
High Temperature Storage
- MIL-STD-202 Method 108 with exemptions
Thermal Shock Test
- JESD22 Method JA-104, Test Conditions B and N
Biased Humidity
- MIL-STD-202 Method 103, 85° C/85 % RH with 10 % operating power for 1000 hr
Operational Life
- MIL-STD-202 Method 108, Test Condition D
Terminal Strength for SMD
Electrical Characterization
- 3 Temperature Electrical Characterization