Materials
- Body: Ceramic
- Cap: Silver-Plated Brass
Product Marking
- Body: Brand Logo, Current Rating
Insulation Resistance (After Opening)
- MIL-STD-202, method 302, Test Condition A (10,000 ohms, Min.)
Resistance to Soldering Heat
- MIL-STD-202, Method 210, Test Condition B (10 sec at 260° C)
PCB Recommendation for Thermal Management
- Minimum copper layer thickness = 100 μm
- Minimum copper trace width = 10 mm
- Alternate methods of thermal management may be used. In such cases, under normal operations, the Max. temperature of the fuse body should not exceed 80° C in a 25° C environment
Operating Temperature
- -55° to 125° C with proper derating
Thermal Shock
- MIL-STD-202, Method 107, Test Condition B, 5 cycles, -65° to 125° C, 15 minutes @ each extreme
Mechanical Shock
- MIL-STD-202, Method 213, Test Condition I: De-energized. 100G’s peak amplitude, sawtooth wave 6 ms duration, 3 cycles XYZ+xyz = 18
Vibration
- MIL-STD-202, Method 201: 0.03" amplitude, 10-55 Hz in 1 min. 2 hours each XYZ = 6 hours (10-55 Hz)
Moisture Resistance
- MIL-STD-202F, Method 106, 10 cycles
Salt Spray
- MIL-STD-202, Method 101, Test Condition B (48 hours)
Thermal Cycling
- 500 cycles: 15 minutes at -30° C (+0/-5° C), 5° C / minute ramp rate up to 80° C, 15 minutes at 80° C (+3/-0° C), 5° C / min-ute ramp rate back down to -30° C