Materials
- Body: Ceramic
- Cap: Silver-Plated Brass
Product Marking
- Body: Brand Logo, Current Rating
Insulation Resistance
- MIL-STD-202, method 302, Test Condition A (10,000 ohms, Min.)
Resistance to Soldering Heat
- MIL-STD-202, Method 210,Test Condition B (10 sec at 260° C)
PCB Recommendation for Thermal Management
- Alternate methods of thermal management may be used. In such cases, under normal operations, the Max. temperature of the fuse body should not exceed 90° C in a 25° C environment
- Minimum copper trace width = 15 mm (40 A) / 25 mm (50 A)
- Recommended copper trace weight = 3 oz. (40 A) / 6 oz. (50 A)
- For PSE requirements: Min. Copper trace width = 35 mm, Recommended Copper trace weight = 6 oz.
Operating Temperature
- -55° to 125° C with proper derating
Thermal Shock
- MIL-STD-202, Method 107, Test Condition B (5 cycles -65° to 125° C)
Vibration
- MIL-STD-202, Method 201 (10-55 Hz)
Moisture Sensitivity Level
Moisture Resistance
- MIL-STD-202 Method 106, High Humidity (90-98 % RH), Heat (65° C)
Salt Spray
- MIL-STD-202, Method 101, Test Condition B
Mechanical Shock
- MIL-STD-202, Method 213, Test Condition I (100 G’s peak for 6 ms)