Materials
- Body: Epoxy Resin
- Terminations: Cu/Ni/Sn (100 % Pb-free)
Product Marking
- Body: Ampere Marking Code. See Part Marking in Datasheet
Insulation Resistance
- IEC 60127-4 (0.1 MΩ Min.)
Resistance to Soldering Heat
- MIL-STD-202, Method 210, Condition B
Biased Humidity
- MIL-STD-202, Method 103, 85° C/85 % RH with 10 %operating power for 1000 hours
Operational Life
- MIL-STD-202, Method 108, Test Condition D
Mechanical Shock
- MIL-STD-202, Method 213, Condition A
Moisture Sensitivity Level 1
- IPC/JEDEC J-STD-020D Level 1