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881 Series - NANO²® High Current Subminiature Surface Mount Fuse
Brand: Littelfuse, IncThe 881 Series NANO²® fuse is a relatively small sized, high current, surface-mount fuse which provides over current protection for applications of high operating current in a limited space.
Such applications are mostly served today through a single large-sized high-current industrial type fuse or in some cases, parallel configuration of lower amperage SMD fuses.
The 881 Series fuses provide the option of a single fuse solution for protection for such application requirements.
Features- Available in 60A ~ 100A in a small footprint (12.5mm x 10mm) and Low Profile (6.8mm)
- High interrupting rating at 1500A@75VDC
- Opening time at 200% overcurrent available at 60 secs max.
- Very low cold resistance values
- Low temperature rise and voltage drop
- Wide operating temperature range from -55oC to 100oC
- Robust Fuse design
- RoHS compliant, Halogen Free, 100% Pb-Free parts
- Surface Mount Fuse
- Single fuse solution for high current application requirements. Parallel fusing or use of over specked industrial type fuses can be avoided
- High wattage equipment can be designed with less board space reserved for protection components
- Relatively high interrupting rating will suit a wide variety of applications
- Guaranteed protection against overload and short circuit events in applications
- Enhance power efficiency by optimized thermal performance and minimizing power loss
- Applicable to a wide range and harsh operating environment
- Enhanced reliability and less susceptible to temperature cycling and vibration effects
- Environmental friendly and harmless to human
- Compatible with high volume assembly (Pick-and-place) requirements with the SMD configuration
Specifications
Brand
Materials
- Body: Thermoplastic, RTI 150° C
- Terminations: Tin-Plated Copper
Product Marking
- Brand logo, Voltage Rating, and Ampere Rating
Operating Temperature
- -55° to +100° C with proper derating
- Based on loading at 75 % of ampere rating when mounted using recommended pad layout
- Usage outside of stated operating temperature range requires testing in application. Maintain case temperature below 150° C in application
Thermal Shock
- MIL-STD-202, Method 107, Test Condition B (5 cycles -65° to 125° C)
Moisture Resistance
- MIL-STD-202 Method 106, High Humidity (90-98 % RH), Heat (65° C)
Vibration
- MIL-STD-202, Method 201 (10-55 Hz)
Mechanical Shock
- MIL-STD-202, Method 213, Test Condition I (100 G’s peak for 6 ms)
Resistance to Soldering Heat
- MIL-STD-202, Method 210, Test Condition B (10 sec at 260° C)
Solderability
- MIL-STD-202, Method 208
MSL Test
- Level 2a J-STD-020
Salt Fog
- MIL-STD-202 Method 101 Test Condition B (5 % NaCl solution, 48 hours exposure)
Approvals
- UL
- TÜV
- Blade Servers
- Routers
- Base Station Power Supply
- Uninterrupted Power Supply (UPS)
- High-Power Battery Systems
- Power Factor Correction (PFC) in High Wattage Power Supplies
- Power Distribution Units (PDUs)
- Industrial Tools
