Materials
- Body: Ceramic
- Cap: Silver-Plated Brass
Product Marking
- Body: Brand Logo, Current Rating Rated Voltage, T - C Characteristic "T"
Insulation Resistance (After Opening)
- MIL-STD-202, Method 302,Test Condition A (10,000 ohms, Min.)
Resistance to Soldering Heat
- MIL-STD-202, Method 210, Test Condition B (10 sec at 260° C)
Moisture Sensitivity Level
PCB Recommendation for Thermal Management
- Minimum copper layer thickness = 100 μm
- Minimum copper trace width = 10 mm
- Alternate methods of thermal management may be used. In such cases, under normal operations, the Max. temperature of the fuse body should not exceed 80° C in a 25° C ambient environment.
Operating Temperature
- -55° to 125° C with proper derating
Thermal Shock
- MIL-STD-202, Method 107, Test Condition B (5 cycles -65° to +125° C)
Vibration
- MIL-STD-202, Method 201 (10-55 Hz)
Moisture Resistance
- MIL-STD-202, Method 106, High Humidity (90-98 % RH), Heat (65° C)
Salt Spray
- MIL-STD-202, Method 101, Test Condition B
Mechanical Shock
- MIL-STD-202, Method 213, Test Condition I (100 G’s peak for 6 ms)