Materials
- Body: Epoxy resin (UL 94 V-0 Certified)
- Terminations: Cu/Ni/Sn (100 % Pb-free)
Moisture Sensitivity Level
- IPC/JEDEC J-STD-020C, Level 1
Solderability
- IPC/EIC/JEDEC J-STD-002B,Condition B
Resistance to Soldering Heat
- MIL-STD-202, Method 210F, Condition B
Thermal Shock
- MIL-STD-202, Method 107G, Condition B-3
Mechanical Shock
- MIL-STD-202, Method 213B, Condition A
Vibration, High Frequency
- MIL-STD-202, Method 204D, Condition D
Dissolution of Metallization
- IPC/EIC/JEDEC J-STD-002B, Condition D