Materials
- Body: Advanced Ceramic
- Terminations: Ag/Ni/Sn (100 % Lead-free)
- Element Cover Coating: Lead-free Glass
Moisture Sensitivity Level
- IPC/JEDEC J-STD-020, Level 1
Humidity
- MIL-STD-202, Method 103, Condition D
Solderability
- IPC/EIC/JEDEC J-STD-002, Condition B
Resistance to Soldering Heat
- MIL-STD-202, Method 210, Condition B
Thermal Shock
- MIL-STD-202, Method 107, Condition B-3
Mechanical Shock
- MIL-STD-202, Method 213, Condition A
Vibration, High Frequency
- MIL-STD-202, Method 204, Condition D
Dissolution of Metallization
- IPC/EIC/JEDEC J-STD-002, Condition D